Marked PCBs are delivered in a raw state and put on racks by the SMT line operator. Automated loaders, then move the PCBs onto the SMT line. The PCBs need to be delivered to the line in the proper quantity and flow. PCBs begin to move on the conveyor, starting the screen-printing process.
To begin the surface mounting process for a project, SMT programmer configures the FUJI NXT machine and project operator loads it with the feeders in the assigned positions with the components required for the project. After this is done, the first steps – the application of solder paste and screen-printing process begin.
The soldering paste is pressed through the apertures of the stencil, onto the contact pads of the PCB. Double lanes can simultaneously assemble both sides of the PCB board, which fastens the assembly process by double.
The soldering paste is made of tiny pieces of metal solder and tacky flux that stick to the metal parts of the printed circuit board. The flux in the solder paste holds all the parts in place until the board is heated in the reflow oven.
We use automatic FUJI GPX-C screen printers, which are supplied with a machine vision system that ensures that the stencil and the board are correctly aligned, allow to apply different squeegee pressure on the parts of the board and provides high accuracy screen printing of very small parts.
